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English version below Contexte : Les technologies de packaging avancées sont au cœur de la révolution microélectronique, essentielles pour des domaines comme l’IA, l’aérospatiale et le calcul haute performance. Parmi elles, le Fan-Out Wafer-Level Packaging (FOWLP)
Advanced packaging technologies are at the core of the microelectronics revolution and play a key role in areas such as artificial intelligence, aerospace, and high performance computing. Among these technologies, Fan Out Wafer Level Packaging (FOWLP)
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