English version below Vous souhaitez contribuer à lavenir de la microélectronique aux côtés de chercheurs de renommée internationale et dingénieurs dIBM? Vous êtes attiré(e) par les défis technologiques au cœur des semi-conducteurs avancés, de lintégration hétérogène
English version below Contexte : Les technologies de packaging avancées sont au cœur de la révolution microélectronique, essentielles pour des domaines comme l’IA, l’aérospatiale et le calcul haute performance. Parmi elles, le Fan-Out Wafer-Level Packaging (FOWLP) se
About Xanadu: Xanadu’s mission is to build quantum computers that are useful and available to people everywhere. At Xanadu, we are learners, innovators, researchers, collaborators and problem solvers. We are creating something that has never been
Xanadu seeks a Quantum Nanofabrication Engineer focused on process integration for SNSPD technologies. Utilize your advanced skills to work on cutting-edge quantum computing hardware. Joining the Hardware Team, youll leverage your Ph.D. and extensive cleanroom experience to
About Pasqal Pasqal designs and develops Quantum Processing Units (QPUs) and associated software tools. Our innovative technology enables us to address use cases that are currently beyond the reach of the most powerful supercomputers; these cases
About Canonical Canonical is a leading provider of open source software and operating systems to the global enterprise and technology markets. Our platform, Ubuntu, is widely used in breakthrough enterprise initiatives such as public cloud, data
Advanced packaging technologies are at the core of the microelectronics revolution and play a key role in areas such as artificial intelligence, aerospace, and high performance computing. Among these technologies, Fan Out Wafer Level Packaging (FOWLP) stands out for