WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of
Research Associate, Semiconductors & AI Infrastructure Why YOU want this position At Enverus, we’re committed to empowering the global quality of life by helping our customers make energy affordable and accessible to the world. We are the
Our Team Semtechs Signal Integrity Products (SIP) Business Unit delivers high-performance mixed-signal ICs for data communications and video broadcast industries. Our packaging team plays a critical role in the full IC development lifecycle, working across a highly
Our Team Semtechs Signal Integrity Products (SIP) Business Unit delivers high-performance mixed-signal ICs for the data communications and video broadcast industries — powering the interconnects that move data inside the worlds largest hyperscaler data centers. Our
Fidus is a global high-tech design firm headquartered in Ottawa, with additional design centres in Kitchener-Waterloo and San Jose. We specialize in leading-edge electronic product development, with hardware, embedded software, FPGA/ASIC, and signal integrity teams working
Company:Qualcomm Canada ULC Job Area:Engineering Group, Engineering Group Software Engineering General Summary: We are seeking a skilled and motivated DevOps Engineer to support software development teams through modern DevOps practices, robust tooling, and scalable infrastructure. This
Company:Qualcomm Canada ULC Job Area:Engineering Group, Engineering Group ASICS Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of whats possible to enable next-generation experiences and drives communication and data processing transformation to
Location(s) Nepean, Ontario Eligible for remote Yes Company Molex Career Field Engineering Job Number 190135 Your Job Molex is seeking a Senior Si Photonics Design Engineer to join our Optical Solutions Business Unit (OSBU). In this
Microelectronic Packaging Design Engineer About the job Microelectronic Packaging Design Engineer Job#80142 Job Purpose The Microelectronic Design Engineering team, as part of our companys Global Design Engineering Team, represents one of the key strategic growth areas of the
WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of
Overview Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms,
Job Description Are you passionate about pushing the boundaries of optical package design? Were seeking a talented and driven Packaging Development Engineer to lead the development of next‑generation packaging solutions. In this role, youll be at the forefront
Step into a pivotal leadership role at AMD, driving innovative packaging engineering for next-generation Data Center GPU programs. Utilize your expertise to deliver high-performance designs and streamline processes in a dynamic setting. In this Senior Manager position
Overview Advanced Microsystems Technologies (AMT) is a technology division of Sanmina Corporation, focused on RF, microelectronic, optical components and integrated subsystems. We provide services from design concept through prototype design and testing, process development, assembly and
Join AMD as a Packaging Engineering leader, where your expertise will drive next-generation Data Center GPU and MI package designs. Collaborate in a culture that fosters innovation and results. As a key player, your role involves leading
Compensation: The base annual salary range for this full‑time role is between $94,200 and $130,000. Actual compensation may vary outside of this range and is dependent on various factors, including but not limited to a candidates
A leading semiconductor analytics firm in Ottawa is seeking a Technical Fellow to bridge advanced packaging and system performance. This role requires deep expertise in semiconductor packaging, processor architecture, and innovative technologies. The ideal candidate will have over ten years
Drive semiconductor innovations as TechInsights Technical Fellow in Advanced Packaging Integration, located in Ottawa. Your role will focus on utilizing advanced packaging to enhance computing system performance and integration. In this pivotal position, you will be a key figure
Job Description Advanced Microsystems Technologies, AMT, is a technology division of Sanmina Corporation (Nasdaq: SANM), responsible for the development of RF, Microelectronic, Optical components and Integrated Subsystems, providing services from design concept, through prototype design and
Step into a vital Engineering role with Semtech as a Packaging Engineer, focusing on semiconductor package design. Use your expertise in electrical engineering and manufacturing to enhance product quality and reliability. As a member of Semtechs Signal Integrity