Principal Advanced Optical Packaging Engineer Location: Ottawa, Ontario | Type: Full-time The Opportunity Ranovus is seeking a Principal Advanced Optical Packaging Engineer to develop and industrialize packaging technologies for next-generation optical engines used in AI and data-center connectivity. This
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Senior Optical Technician About Us Ranovus is a semiconductor company with global operations helping power the data behind next generation AI and data center networks. We design and build advanced hardware that moves massive amounts of information
As the global leader in high-speed connectivity, Ciena is committed to a people-first approach. Our teams enjoy a culture focused on prioritizing a flexible work environment that empowers individual growth, well-being, and belonging. We’re a technology
Our Team Semtechs New Product Introduction (NPI) Product Engineering Team is the central engineering function behind every new product we bring to market. Our team of focused and talented engineers takes full ownership of new product
Job Overview: Arm’s Solution Engineering team is very thrilled to work with SoC verification engineers in Toronto! New team members in Toronto will join hands with other RTL design and verification engineers spread across UK, US,
Company:Qualcomm Canada ULC Job Area:Engineering Group, Engineering Group Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of whats possible to enable next-generation experiences and drives digital transformation to help create a
Company:Qualcomm Canada ULC Job Area:Engineering Group, Engineering Group ASICS Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of whats possible to enable next-generation experiences and drives communication and data processing transformation to
As a Program Manager, you will play a vital role in organizing and managing intricate hardware development processes. Your work will have a direct impact on product strategy and design, with high visibility within the organization.
Sheba Microsystems is a Toronto-based high-technology company developing advanced MEMS-based micro-actuator solutions for high-performance camera applications. Our technology combines MEMS innovation, electronics, module assembly and precision manufacturing to enable next-generation imaging systems. As Sheba Microsystems scales
Our Team Semtechs Signal Integrity Products (SIP) Business Unit delivers high-performance mixed-signal ICs for the data communications and video broadcast industries — powering the interconnects that move data inside the worlds largest hyperscaler data centers. Our
Job Description Are you passionate about pushing the boundaries of optical package design? Were seeking a talented and driven Packaging Development Engineer to lead the development of next‑generation packaging solutions. In this role, youll be at the forefront
About Inpho Inpho is a fast-growing startup, focused on developing cutting-edge optoelectronic solutions for next-generation communications, and photonic systems. Our multidisciplinary team is pushing the boundaries of innovation in integrated photonics and semiconductor packaging. Inpho’s new class of
Take on a pivotal full-time MEMS Packaging Engineer role at Sheba Microsystems in Toronto, focusing on micro-actuator technologies for cutting-edge cameras. This position involves assembly, testing, and process optimization. In this role, you will be responsible for
Location: Ottawa, Ontario | Type: Full-time The Opportunity Ranovus is seeking a Principal Advanced Optical Packaging Engineer to develop and industrialize packaging technologies for next-generation optical engines used in AI and data-center connectivity. This hands‑on role covers package/process
Job Description Advanced Microsystems Technologies, AMT, is a technology division of Sanmina Corporation (Nasdaq: SANM), responsible for the development of RF, Microelectronic, Optical components and Integrated Subsystems, providing services from design concept, through prototype design and
Compensation: The base annual salary range for this full‑time role is between $94,200 and $130,000. Actual compensation may vary outside of this range and is dependent on various factors, including but not limited to a candidates
Join AMD as a Packaging Engineering leader, where your expertise will drive next-generation Data Center GPU and MI package designs. Collaborate in a culture that fosters innovation and results. As a key player, your role involves leading
WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of
Requisition ID: -0 Advanced Microsystems Technologies, AMT, is a technology division of Sanmina Corporation (Nasdaq: SANM), responsible for the development of RF, Microelectronic, Optical components and Integrated Subsystems, providing services from design concept, through prototype design